Introduction:
The advent of generative AI, characterized by the likes of ChatGPT, has ushered in a new era in technology, where the demand for high-performance semiconductors capable of efficiently processing vast amounts of data is at an all-time high. As global competition intensifies to develop next-generation semiconductors, the focus has shifted to the "post-process" of the manufacturing cycle, according to Tadahiro Kuroda, a key figure in Japan's semiconductor revival and a member of the University of Tokyo's System Design Research Center. In this discussion, Kuroda, along with Tomomitsu Moka, Chief Strategy Officer of Resonac Holdings, sheds light on the impact of generative AI on the semiconductor industry and how post-processing, coupled with material innovation, holds the key to the next technological leap.
*Generative AI's Impact on Semiconductors:*
Generative AI, exemplified by advanced models like GPT-3.5 and its successor GPT-4, has significantly accelerated the demand for semiconductors. Kuroda notes that the remarkable progress in large-scale language model AI, with GPT-4 ranking in the top 10% of the American bar exam, has led to an extraordinary increase in the number of parameters, ranging from hundreds of billions to over one trillion. Semiconductors, particularly GPUs optimized for generative AI, play a crucial role in handling the computational processing demands imposed by the evolution of generative AI services.
The spread of generative AI has not only prompted technological innovation but has also spurred the entry of major tech companies like Google, Microsoft, Amazon, and Tesla into AI-specific semiconductor chip development, challenging traditional players like NVIDIA. This shift emphasizes the need for dedicated semiconductors tailored for specific AI services rather than relying on general-purpose chips.
*The Significance of Post-Processing:*
Kuroda stresses that the development of next-generation AI semiconductors requires not only performance improvements but also a significant reduction in power consumption. The miniaturization limits of the front-end processes have necessitated a shift in focus to the "post-process" or back-end processing, marking a "game change" in semiconductor innovation.
Post-processing involves the final stages of semiconductor manufacturing, including cutting the wafer, attaching terminals, and covering it with resin. Unlike the front-end processes, which have seen extensive investment, the post-process has received comparatively little attention, making it a focal point for future innovations. With the miniaturization of chips reaching physical limits, the back-end process, or "more than more," has become a crucial avenue for technological advancement.
*Moka's Perspective on Materials and Post-Processing:*
Moka emphasizes the critical role of materials in the post-processing era, particularly in reducing energy waste and enhancing high-speed data processing. The miniaturization of semiconductors, with line distances measuring only a few molecules, necessitates materials that efficiently arrange terminals and reduce electrical resistance. In this context, "material innovation" becomes paramount, focusing on properties such as thermal conductivity, insulation, resistance to cracking, and stability.
Resonac, boasting the world's No. 1 market share in back-end materials, plays a pivotal role in the semiconductor industry. Moka highlights the importance of "co-creation," emphasizing collaboration with competitors, material manufacturers, and companies responsible for manufacturing equipment and design. The newly established "Packaging Solution Center" serves as a research facility for post-processing technology, allowing companies to prototype and evaluate cutting-edge materials, fostering collaboration and co-creation.
*The Role of Materials in Performance Enhancement:*
Kuroda elaborates on the significance of material combinations in post-processing, explaining how stacking semiconductor chips vertically increases conduction efficiency while raising heat density. Achieving a balance in material properties is crucial for maintaining performance, and Japan's strength in semiconductor materials is globally acknowledged.
Materials undergo evaluation based on various properties, and Resonac, as a leader in the field, receives requests for collaboration from global semiconductor manufacturers. Kuroda underscores the need for detailed suggestions tailored to individual customer needs in the post-processing phase, drawing parallels with the customization of pizza ingredients based on customer preferences.
*Resonac's Co-Creation Approach:*
Moka describes Resonac's commitment to co-creation, bringing together technical capabilities to propose cutting-edge packaging solutions. The company's early entry into the market, combined with the ability to involve customers positively in its vision and direction, has created significant barriers to entry for competitors. By hiring package engineers with experience in back-end processes, Resonac negotiates from a customer's perspective, improving its ability to make tailored proposals.
*Future Path and Silicon Valley Expansion:*
Looking ahead, Moka envisions Resonac's continued success as post-processing technology gains prominence, linked to the rapid growth of the AI semiconductor market. Resonac aims to be a leader globally and in Japan, leveraging its strengths in post-process materials. To facilitate global collaboration, Resonac plans to establish a new R&D base for back-end processes in Silicon Valley, recognizing it as a hub for AI semiconductor lead users and cutting-edge packages.
In conclusion, the semiconductor industry is undergoing a transformative phase, with post-processing and material innovation emerging as the linchpins for future technological breakthroughs. The co-creation approach, exemplified by Resonac, not only addresses the current challenges but positions the industry to thrive amidst the evolving landscape of AI-driven advancements. The intersection of generative AI, post-processing, and material innovation signifies a new frontier in semiconductor technology, promising exciting developments and continued global collaboration.
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